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Dell & HP are whispered to be 1st takers of the new-fangled technology which pledges 10% more in battery sprint time. Worlds 3rd biggest producer of secondary cells, Samsung SDI, predicts to make available its newest Li-ion power packs to US-located PC producers like HP & Dell beginning from July this year. The innovative 2,800mAh Samsung battery cells under the scanner reveal 7.7% more capability and nearly 10 percent more usage time. They are also equipped to be faster than the regular 2,600mAh (milli-ampere hour) rechargeable batteries mainly utilized in notebook computers.

The company also has sketches to initiate a 3,000mAh rechargeable battery in the in the vicinity of future with 20% longer usage time. Industry sources predict the demand for lithium ion rechargeable battery power packs to sprint up to 2.85 billion unit cells in the year 2008, and a predicted increase of 18 percent from the overall unit cells that’s been on use for the previous year, and the demand for secondary cells for PCs are expected for an overall rise of 22 percent. With so much of prediction and the innovations taking the upper hand, the field of longer battery hours and a successful invention of a prospective notebook battery are definitely on the cards. Only aspect is the market should be ready for the grabs.

VIA Technologies, Inc, a principal leading light of power proficient x86 processor platforms today revealed the new-fangled VIA Open-Book, mini-note allusion design embattled at the swiftly growing global marketplace for ultra-portable laptops.
The VIA Open-Book mini-note orientation intend introduces a swarm of novel innovations, together with the next age band of VIA Ultra Mobile Platform, based on the VIA C7®-M ULV processor and the innovative all-in-one VIA VX800 digital media IGP chipset. Mutually, this ultra packed together, power proficient platform provides the user with more affluent computing and multimedia skin texture, inclusive of a startling 8.9” screen and superior video playback shore up, in a compacted and fashionable clamshell outward appearance feature that weighs at just a mere 1kg.

The VIA Open-Book serves a supple in-house crossing point for high-speed broadband wireless connectivity that serves customers with the aptitude to decide on from an array of option provided like Wi-MAX, HSDPA and EV-DO/W-CDMA modules suitable to their market. In adding together, under a only one of its kind mutual approach, the CAD files of the peripheral panels of the orientation design are presented for download under a Creative Commons ascription Share Alike 3.0 license to serve the likes of customers such as OEMs, system integrators, and broadband service providers with superior freedom in tailoring the glance and feel of their piece of equipment to convene the varied needs of their intended markets.